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Wedge Bonder - List of Manufacturers, Suppliers, Companies and Products

Wedge Bonder Product List

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Solar and secondary battery large wire wedge bonder "BJ980"

Adoption of a central control system! Automatic calibration updates.

The "BJ980" has been newly developed for the wide area where demand is increasing, particularly for solar and battery products. The highly versatile bonding area features a wedge bonder with dimensions of X700mm and Y1132mm, allowing for the construction of fully automatic or manual operation systems. We have developed a bonding head for thick wires equipped with a unique transducer that includes sensors for non-destructive testing of bond head pull tests and real-time bond quality inspection. 【Features】 ■ Flexible, one of the largest work areas in the industry: 1700mm × 1132mm ■ Bond head: 150μm - 600μm, compatible with aluminum, copper, and aluminum-copper clad ■ Ribbon maximum 2000um × 400um (80mil × 16mil) ■ High-precision programmable bond force actuator ■ Components using wear-free piezo technology *For more details, please refer to the PDF document or feel free to contact us.

  • Bonding Equipment

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Aluminum wire/ribbon wire compatible wedge bonder PowerFusion

Wedge bonder equipped with a direct drive motion system and a high-performance image recognition system, achieving high productivity and reliability.

Introducing the PowerFusion wedge bonder manufactured by K&S, handled by Techno Alpha. PowerFusion is a fully automatic wedge bonder for lead frame package devices, featuring the latest beltless direct drive motion system and a high-performance image recognition system, significantly improving productivity (UPH) and reliability compared to conventional models. Additionally, it offers a bond head configuration ranging from a single head type to a maximum of six heads, allowing for high productivity tailored to application needs and enabling line changes as necessary. 【Features】 <Productivity> - UPH increase: Adoption of direct drive servo system and high-speed image recognition system - MTBA increase: Enhanced uptime due to high-performance image recognition system <Performance> - Customizable loop profile - Improved bond position repeatability - Reduced damage to lead frames through the use of an input kicker with adjustable overload settings <Advanced Package Compatibility> - Support for small power devices - Expanded bond area - Improved indexing accuracy

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  • Bonding Equipment
  • Other semiconductor manufacturing equipment

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BJ931 High-Speed Fully Automatic Wedge Bonder with Lead Frame Transport

Dual-head wedge bonder for high-speed, high-precision, and high-productivity lead frames.

The high-speed fully automatic dual-head wedge bonder Bondjet BJ931 meets the latest technologies and various demands for automotive products and power semiconductors. It supports aluminum wire, copper wire, gold wire, and ribbon, and the bond head can be replaced in just a few minutes. With a robust and clean design, the industry's largest bonding area, long maintenance intervals, user-friendly software, and support features, the Bondjet BJ931 can also be equipped with Hesse Mechatronics' industry-leading process monitoring system PiQC.

  • Bonding Equipment

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